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Nanotech


Epson's M-A352 Accelerometer Ideal for Structure Health Monitoring

Epson acceleration sensing technology helps realize safer social infrastructure

Seiko Epson Corporation (TSE: 6724, "Epson") has developed a new high-performance three-axis accelerometer, the M-A352. Samples will begin shipping at the end of 2018, with volume production scheduled for the spring of 2019.

Announcing Kronos™ 1080 and ICOS™ F160 Inspection Systems: Expanding KLA-Tencor's IC Packaging Portfolio

KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges. The Kronos™ 1080 system offers production-worthy, high sensitivity wafer inspection for advanced packaging, providing key information for process control and material disposition. The ICOS™ F160 system examines packages after wafers have been diced, delivering fast, accurate die sort based on detection of key defect types—including sidewall cracks, a new defect type affecting the yield of high-end packages. The two new inspection systems join KLA-Tencor's portfolio of defect inspection, metrology and data analysis systems that help accelerate packaging yield and increase die sort accuracy.

Toshiba Announces New Analog Output IC Photocoupler for Automotive Applications

- New device delivers high-speed communications capability to the automotive environment
oshiba Electronic Devices & Storage Corporation (“Toshiba”) announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV).

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